Automated Dispensing System
[Automated Adhesive Dispensing for optical/electronic component production]
The system delivers the precision and accuracy needed for today’s small electronics manufacturing and assembly processes. Whether the application is bonding, sealing, or encapsulation, our proven automated dispense technologies provide unmatched reliability and durability. Components can be fed into the machine without sorting. The finished components are placed in an output tray automatically.
Flexible and modular designs and equipment sizes adapt easily as materials and parts change to ultimately streamline your processes, improve productivity and lower your bottom line.